Circuit forming process



The invention relates to a circuit forming process, which comprises the following steps of: arranging a plurality of glue dots on one surface of a carrier; adhering an electronic element onto each glue dot; forming protective layers on the surface on which the glue dots are arranged; forming a circuit path between the protective layers; forming a circuit layer in the circuit path; and removing the protective layers. By the process, the circuit layer is uniform or complete, and the electronic elements and the carrier which are combined can have low impedance so as to avoid power waste.




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